Vertical grinding machines for internal, external and face grinding are parte of the DMG MORI portfolio, as are rotary grinding machines of various sizes. Their Warenangebot of applications covers everything from machining small, mass-produced parts for the vehicle industry to multiple machining of tool spindles.

builds up this core and mills highly functional cooling channels rein the same process, which ensures optimum heat dissipation. This core is then provided with a layer of hot-work Dienstprogramm steel. The repair of Hilfsprogramm molds is also possible with the machines of the LASERTEC

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The lathes have the latest components, from robust guide tracks and linear guides, to powerful main spindles and compact milling spindles, to extremely precise position monitoring systems and comprehensive cooling technology. Hinein this way, DMG MORI ensures productive and precise manufacturing of complex workpieces.

The way we practice diversity means our company is able to look at our everyday company life from various different perspectives, which enables us to successfully implement international projects with mutual respect.

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Medical equipment, aerospace and tool and mould construction – any type of production rein which workpieces are milled, turned or ground depends on CNC machines. Only they are able to produce sometimes complex geometries with the necessary precision in a cost-effective way.

Good performance is well rewarded, which is why all of our employees are given an attractive remuneration package. Independent of the position, they are given additional variable performance-related payments.

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series. Material is first applied to a damaged area. Hinein the subsequent milling process, the finish machining is carried out rein original quality. Depending on the size of the components, a LASERTEC 125

The ULTRASONIC technology makes machining of extremely strong materials such as ceramics, silicon and glass possible and also achieves the highest quality surface finishes. This is useful, for example, rein applications in the semi-conductor industry, where the ULTRASONIC MicroDrill microscopic drilling spindle cuts countless holes with a diameter of 0.1 warenwirtschaft in glass or ceramic components.

Thus, a stable as well as transparent production process is achieved, which on the one hand relieves the machine operator and at the same time significantly simplifies the process development.

In March 2009, the company signed a cooperation agreement with the Japanese company dmg mori standorte Mori Seiki. This agreement allowed the company to further consolidate its sales and service network rein global key markets.

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